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From time to time new standard amendments, reports and papers are released. These include IPC standard amendments, SMEMA Council Papers and GenCam standards. These can now be downloaded FREE below.
All the downloads require Acrobat Reader click here to download the latest version
This voluntary standard establishes minimum requirements for the design, installation, operation and maintenance of electrically heated process equipment in order to minimize electrical hazards and prevent fires that may occur in combustible tanks, tank liners and drying equipment.
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The January 2000 release of Amendment 1 for the IPC-2221 standard provides expanded coverage of plated-through hole test specimens in addition to a new test specimen for the purpose of evaluating bending flexibility and endurance for flexible printed wiring applications. This amendment also includes updated figures for etched conductor characteristics and printed board size standardisation.
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This document describes a PWB fabrication data quality rating system used by fabricators to evaluate the incoming data package integrity. Includes information on conformance to both fabricator and customer design rules and can be used by printed board designers as an output quality check.
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It's here! Amendment 1 for the IPC-6012A includes updating of the plating requirements for electrodeposited copper, as well as corrections to specifications for metal core printed boards following industry use of IPC-6012A. Corrections have also been made for the tables highlighting internal layer thickness as well as external conductor thickness after plating.
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The repairs have been made, and it's ready to roll. IPC-6013, Amendment 1, includes corrections noticed by industry following the publication and regular use of IPC-6013. In addition to technical changes to the requirements in Section 3, the qualification and conformance testing, sampling plan, acceptance testing and qualification tables have been updated. Just like IPC-6012, Appendix 1 now serves as a requirements cross reference.
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Developed and approved for distribution by the IPC Flexible Circuits Committee, this position paper serves as a guide for manufacturers and OEMs in transitioning from MIL-P-50884C and MIL-PRF-31032 to IPC-6013 and Amendment 1.
The position paper offers a history of military specifications, from their overall development to the initiation of the Perry Initiative and Acquisition Reform. Also included in this document is a guide for implementing a Single Process Initiative (SPI), made available by the Department of the Navy (DoN).
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IPC-7711/7721 Rework, Repair and Modification of Printed Boards and Electronic Assemblies
IPC-7771 Change 1 includes: (1) Updates to clause 1.2.1, Procedures 2.1A Handling Electronic Assemblies, 3.1.1A Continuous Vacuum Method and 5.5.1A Multi-Lead Method - Top of Lead (2) New clause 1.9.9, New Procedures Through Hole Desoldering 3.1.2 Continuous Vacuum Method - Partial Clinch, 3.1.3 Continuous Vacuum Method - Full Clinch, 3.1.4 Full Clinch Straightening Method, 3.1.5 Full Clinch Wicking Method, Chip Installation 5.3.2 Point to Point Method and BGA Reballing Procedure 5.7.3.
IPC-7721 Change 1 includes updates to Procedures 4.2.1 Conductor Repair, Foil Jumper, Epoxsy Method and 4.2.5 Conductor Repair Through Board Wire Method. New Procedures have been added; 6.1 Jumper Wires and 6.2.1 Jumper Wires, BGA Components, Foil Jumper Method.
IPC-7721 Change 2 includes new 6.3 Component Modifications and Additions.
Updated Table of Contents pages and Acknowledgement pages are also included.
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Download IPC-7721 Change 1 (
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Many printed circuit board users have developed internal processes to evaluate the capabilities of their printed circuit board fabricators. Fabricators often receive multiple requests from multiple customers to manufacture test panels as part of qualification procedures.
The PCQR2 process provides an industry standard for the design of these benchmark process capability test panels. The data resulting from this process provides database subscribers with the ability to review detailed results from individual fabricators, and to compare the capabilities of multiple fabricators across the industry.
This document describes this process for evaluating the manufacturing capability of key attributes specified in the design and acceptability standards controlled by IPC.
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 | IPC SMEMA Council is made up of suppliers to the electronics assemblers, particularly equipment manufacturers. It initiates and drives technical, managerial, and financial programs to enhance the working relationships and equipment compatibility within the electronics assembly industry. |
| SMEMA 1.2 Mechanical Equipment Interface Standard ( 74Kb) The SMEMA machine interface standards were developed to facilitate the interface of equipment used in the manufacture of surface-mounted printed circuit boards. This standard is for Mechanical interfaces. SMEMA 3.1 Fiducial Mark Standard SMEMA 4 Reflow Terms and Definitions ( SMEMA 5 Screen Printing Terms and Definitions ( SMEMA 6 Electronics Cleaning Terms and Definitions (as they relate to printed circuit assembly cleaning) ( SMEMA 7 Fluid Dispensing Terms and Definitions ( SMEMA Standard Recipe File Format Specification ( | |
GenCAM is documented in IPC-2511A and a series of seven major sectional standards. These are identified as IPC-2510 series. All seven sectional standards, numbered IPC-2512A through IPC-2518A, were released in November 2000. All of the documents can be FREE downloaded here. Additional information is available by accessing the GenCAM website at www.gencam.org. This exciting standardised format is user friendly, easy to read, machine independent, cost competitive and updateable.
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